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ILX531A 5150-pixel CCD Linear Sensor (B/W) Description The ILX531A is a reduction type CCD linear sensor developed for high resolution copiers. This sensor reads A3-size documents at a density of 400 DPI, and A4-size documents at a density of 600 DPI at high speed. Features * Number of effective pixels: 5150 pixels * Pixel size: 7m x 7m (7m pitch) * Clamp circuit are on-chip * Signal output phase of two-output simultaneous-output (alternate-output is available) * Ultra high sensitivity/Ultra low lag * Maximum data rate: 40MHz * Single 12V power supply * Input clock pulse: CMOS 5V drive * Package: 22 pin Plastic DIP (400mil) Absolute Maximum Ratings * Supply voltage VDD * Operating temperature * Storage temperature Pin Configuration (Top View) 22 pin DIP (Plastic) Block Diagram ROG pulse generator VDD VDD 2-EVEN 1-EVEN CCD analog shift register CCD analog shift register Read out gate Read out gate CLP-EVEN RS-EVEN LH-EVEN VDD 19 2 21 RS-ODD 1 21 RS-EVEN 20 LH-EVEN 19 18 17 16 15 14 VDD VOUT-EVEN VDD NC LH-ODD 3 GND VOUT-ODD 4 5 VGG 6 GND 2-ODD 1-ODD 7 8 9 5150 VOUT-EVEN 18 2-EVEN GND 1-EVEN VDD VGG 6 VDD 10 ROG 11 13 12 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E97X25B97-PS VOUT-ODD 5 GND 4 CLP-ODD Output amplifier Output amplifier 22 1 RS-ODD CLP-ODD 1 22 CLP-EVEN 2 LH-ODD 20 3 D74 S1 S2 15 -10 to +60 -30 to +80 V C C 17 GND 14 2-ODD 15 8 1-ODD 13 9 VDD 12 10 ROG 11 S5149 S5150 D75 D94 D25 D26 ILX531A Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 Symbol RS-ODD LH-ODD GND VOUT-ODD VGG GND 2-ODD 1-ODD VDD ROG Description Pin No. 12 13 14 15 16 17 18 19 20 21 22 Symbol VDD 1-EVEN GND 2-EVEN NC VDD VOUT-EVEN VDD LH-EVEN RS-EVEN Description 12V power supply Clock pulse input (even pixel) GND Clock pulse input (even pixel) NC 12V power supply Signal out (even pixel) 12V power supply Clock pulse input (even pixel) Clock pulse input (even pixel) CLP-ODD Clock pulse input (odd pixel) Clock pulse input (odd pixel) Clock pulse input (odd pixel) GND Signal out (odd pixel) Output circuit gate bias GND Clock pulse input (odd pixel) Clock pulse input (odd pixel) 12V power supply Readout gate clock pulse input CLP-EVEN Clock pulse input (even pixel) Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12 Max. 12.6 Unit V Clock Characteristics Item Input capacity of 11, 21 Input capacity of LH1 Input capacity of RS1 Input capacity of CLP1 Input capacity of ROG Symbol C1, C2 CLH CRS CCLP CROG Min. -- -- -- -- -- Typ. 400 10 10 10 10 Max. -- -- -- -- -- Unit pF pF pF pF pF 1 It indicates that 1-ODD, 1-EVEN as 1, 2-ODD, 2-EVEN as 2, LH-ODD, LH-EVEN as LH, RS-ODD, RS-EVEN as RS, CLP-ODD, CLP-EVEN as CLP. Clock Frequency Item Symbol Min. -- -- Typ. 1 2 Max. 20 40 Unit MHz MHz 1, 2, LH, RS, CLP f1, f2, fLH, fRS, fCLP Data rate fR Input Clock Pulse Voltage Condition Item 1, 2, LH, RS, CLP, ROG pulse voltage High level Low level Min. 4.75 -- -2- Typ. 5.0 0 Max. 5.25 0.1 Unit V V ILX531A Electrooptical Characteristics (Note 1) (Ta = 25C, VDD = 12V, fR = 2MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Item Sensitivity1 Sensitivity2 Sensitivity nonuniformity Saturation output voltage Saturation exposure Register imbalance Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Symbol R1 R2 PRNU VSAT SE RI VDRK DSNU IL IVDD TTE ZO VOS Min. 8.2 -- -- 1.8 0.13 -- -- -- -- -- 92 -- -- Typ. 11 25.1 4 2.5 0.23 1 0.3 0.6 0.02 30 98 150 6.5 Max. 13.8 -- 10 -- -- 7 2.0 5.0 -- 60 -- -- -- Unit V/(lx * s) V/(lx * s) % V lx * s % mV mV % mA % V Remarks Note 2 Note 3 Note 4 Note 5 Note 6 Note 7 Note 8 Note 9 Note 10 -- -- -- Note 11 Notes 1) In accordance with the given electrooptical characteristics, the even black level is defined as the average value of D6, D8, to D24. The odd black level is defined as the average value of D5, D7, to D23. 2) For the sensitivity test light is applied with a uniform intensity of illumination. 3) W lamp (2854K) 4) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT = 500mV (Typ.) PRNU = (VMAX - VMIN) /2 VAVE x 100 [%] Where the 5150 pixels are divided into blocks of even and odd pixels, respectively. The maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 5) Use below the minimum value of the saturation output voltage. 6) Saturation exposure is defined as follows. SE = VSAT/R1 7) RI is defined as indicated bellow. VOUT = 500mV (Typ.) RI = | VODD-AVE - VEVEN-AVE | x 100 [%] VODD-AVE + VEVEN-AVE 2 ( ) Where average of odd pixels output is set to VODD-AVE, even pixels to VEVEN-AVE. 8) Optical signal accumulated time int stands at 10ms. 9) The difference between the maximum and average values of the dark output voltage is calculated for even and odd respectively. The larger value is defined as the dark signal nonuniformity. Optical signal accumulated time int stands at 10ms. -3- ILX531A 10) VOUT = 500 mV (Typ.) 11) VOS is defined as indicated bellow. VOUT VOS GND -4- Clock Timing Chart 1 (simultaneous output) ROG 5 5 1-ODD 1-EVEN LH-ODD LH-EVEN 0 2-ODD 2-EVEN 5 0 RS-ODD RS-EVEN 5 0 CLP-ODD CLP-EVEN 5 0 1 2 3 D69 D71 D73 S1 S3 S5145 S5147 S5149 D75 D77 D79 D81 D83 VOUT-ODD D1 D3 D5 D23 D25 D27 D70 D72 D74 S2 S4 D26 D28 S5146 S5148 S5150 D76 D78 D80 D82 D84 VOUT-EVEN Optical black (48 pixels) Dummy signal (74 pixels) 1-line output period (5244 pixels) Note) The transfer pulses (1, 2, LH) must have more than 2622 cycles. D2 D4 D6 D24 D94 D93 2622 0 -5- ILX531A ILX531A Clock Timing Chart 2 t4 t5 ROG t2 t6 t7 1 LH t1 t3 2 Clock Timing Chart 3 t7 1 LH t6 2 t10 t9 RS t8 t11 t14 t13 CLP t12 t15 t16 VOUT t17 Clock timing of 1, 2, LH, RS, CLP and VOUT at odd or even are the same as timing chart 3 in the case of alternate output. -6- ILX531A Clock Timing Chart 4 Cross point 1 and 2 1 5V 1.5V (Min.) 2 0V 1.5V (Min.) Cross point LH and 2 2 5V 2.0V (Min.) LH 0V 0.5V (Min.) -7- Clock Timing Chart 5 (alternate output) ROG 5 0 1 2 3 1-ODD LH-ODD 5 0 2-ODD 5 0 5 1-EVEN LH-EVEN 0 2-EVEN 5 0 RS-ODD 5 0 D1 D3 D5 D69 D71 D73 S1 S3 D75 D77 D79 D81 D83 D23 D25 D27 VOUT-ODD RS-EVEN 5 CLP-EVEN 0 5 0 D2 D4 D6 D24 D26 D28 S5145 S5147 S5149 D70 D72 D74 S2 S4 D76 D78 D80 D82 D84 D93 D94 VOUT-EVEN Optical black (48 pixels) Dummy signal (74 pixels) 1-line output period (5244 pixels) Note) The transfer pulses (1, 2, LH) must have more than 2622 cycles. Alternate output is available by making 1-EVEN, 2-EVEN, LH-EVEN, RS-EVEN, CLP-EVEN delayed to 1-ODD, 2-ODD, LH-ODD, RS-ODD, CLP-ODD for half a cycle. S5146 S5148 S5150 -8- CLP-ODD 5 0 2622 ILX531A ILX531A Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise time/2 pulse fall time 1 pulse fall time/2 pulse rise time RS pulse high level period RS, CLP pulse timing RS pulse rise time RS pulse fall time CLP pulse high level period CLP, LH pulse timing CLP pulse rise time CLP pulse fall time Signal output delay time Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 Min. 50 600 400 0 0 0 0 10 10 0 0 10 5 0 0 -- -- Typ. 100 1000 1000 5 5 20 20 2001 2001 10 10 2001 501 10 10 8 15 Max. -- -- -- 10 10 60 60 -- -- 30 30 -- -- 30 30 -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 1 These timing is the recommended condition under f1 = 1MHz. -9- Application Circuit (simultaneous output) 5.1k VOUT-EVEN Tr1 100 22 21 16 20 19 18 17 15 14 12 13 VDD NC VDD GND RS-EVEN LH-EVEN CLP-ODD CLP-EVEN VOUT-EVEN 2-EVEN GND VDD 1-EVEN RS-ODD VOUT-ODD LH-ODD VGG - 10 - 3 0.1F 100 Tr1 2 VOUT-ODD IC1 5.1k 2 4 7 8 5 6 9 1 GND 2-ODD 1-ODD 2 10 ROG 11 12V 100 100 100 VDD 47F/16V IC1 0.1F CLP RS LH 2 1 ROG IC1 : 74AC04 Tr1 : 2SC2785 Data rate fR = 2MHz. ILX531A Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. ILX531A Example of Representative Characteristics Spectral sensitivity characteristics (Standard characteristics) 1.0 0.8 Relative sensitivity 0.6 0.4 0.2 0 400 500 600 700 800 Wavelength [nm] 900 1000 Dark signal output temperature characteristics (Standard characteristics) Integration time output voltage characteristics (Standard characteristics) 10 5 Output voltage rate Output voltage rate 0 1 1 0.5 0.5 0.1 10 20 30 40 50 Ta - Ambient temperature [C] 60 0.1 1 5 int - integration time [ms] 10 Offset level vs. VDD characteristics (Standard characteristics) Ta = 25C 10 Offset level vs. Temperature characteristics (Standard characteristics) VOS Ta 10 -2mV/C VOS - Offset level [V] 8 VOS - Offset level [V] 0.6 12.6 8 6 6 4 VOS VDD 2 4 2 0 11.4 12.0 VDD [V] 0 0 10 20 30 40 50 Ta - Ambient temperature [C] 60 - 11 - ILX531A Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Cover glass , , Plastic portion 39N 29N 29N 0.9Nm Ceramic portion Adhesive (1) (2) (3) (4) , , , , , , , , , , , , b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. d) The notch of the plastic portion is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion. - 12 - ILX531A 3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. - 13 - Package Outline Unit: mm 22pin DIP(400mil) 55.7 0.3 5.0 0.3 22 12 10.0 0.3 1 11 53.0 4.0 0.5 0.3 M 1. The height from the bottom to the sensor surface is 2.38 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. PACKAGE STRUCTURE PACKAGE MATERIAL Plastic, Ceramic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42ALLOY PACKAGE MASS 5.43g ILX531A DRAWING NUMBER LS-B20-01(E) 4.28 0.5 2.54 0.51 3.58 (AT STAND OFF) 10.16 0.25 H No.1 Pixel 7.3 V 0to 9 11.12 0.3 36.05(7mX5150pixels) - 14 - |
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